| 摘要 |
A semiconductor component includes a leadframe (11, 40) having leads (12, 41) and a ground plane (13, 42) wherein the ground plane (13, 42) has an opening (15, 45). A semiconductor substrate (21) is located in the opening (15, 45) and is approximately coplanar with the ground plane (13, 42). The coplanarity shortens the ground plane wire bonds (23) and improves the electrical performance of the semiconductor component.
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