Method for polishing thin plate and apparatus for polishing

摘要

A method and an apparatus, for polishing a thin plate. The method comprises the steps of: rotating a holding plate on one surface of which the thin plate is held to adhere; and bringing the thin plate held on the rotating holding plate into contact with a polishing pad mounted on a surface of a rotating turn table, to polish the thin plate. The step of polishing the one surface of the holding plate is carried out by using the polishing pad for polishing the thin plate before the thin plate is held to adhere on the one surface of the holding plate.