发明名称 |
Printed wiring board with mounted circuit element using a terminal density conversion board |
摘要 |
A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board. |
申请公布号 |
US5936843(A) |
申请公布日期 |
1999.08.10 |
申请号 |
US19980040393 |
申请日期 |
1998.03.18 |
申请人 |
FUJITSU LIMITED |
发明人 |
OHSHIMA, OSAMU;UDAGAWA, YOSHIAKI;SUZUKI, MASAHIRO;NISHIYAMA, TAKESHI |
分类号 |
H01L23/12;H05K1/14;H05K3/34;H05K3/36;H05K3/46;(IPC1-7):H05K1/14 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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