| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of an electronic part without short- circuiting electrodes at the time of mounting the electronic part with bump on the electrode of a narrow pitch. SOLUTION: At the time of mounting an electronic part with bump, where the solder bump is formed on the electrode of a substrate, bond containing hardener whose melting point is lower than a solder melting temperature Tm is applied and the electronic part with bump is held by an application tool so as to load it on the substrate. It is heated while it is depressed. In a heating process, the hardening of bond is started before the solder bump is melted and the periphery of molten solder is surrounded by bond whose viscosity is high. When the temperature reaches a control switch temperature range which is set to a temperature lower than the solder melting temperature Tm, a control system is switched to that controlling the height (h) of the electronic part with bump against the substrate from the control system controlling the depression charge F of the electronic part with bump. Thus, the convection of molten solder is suppressed and short-circuiting can be prevented between the electrodes. |
