INSULATION PASTE COMPOUND, CONDUCTOR PASTE COMPOUND AND CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To adequately control the deterioration of insulation resistance between wiring portions regardless of the presence or absence of water or water vapor when a voltage is applied under high temperature atmosphere on a circuit substrate having a wiring portion containing silver. SOLUTION: On a circuit substrate 10, a plurality of line-shaped wiring portions 2 containing silver are formed. Between the wiring portions 2 on the substrate 1, potassium oxide such as oxide potassium or glass including this (such as potassium oxides) is present. Potassium oxides can be adhered between the wiring portions 2 on the substrate 1 by coating or baking insulating paste compound containing potassium compound or by forming wiring portions 2 by coating or baking conductor paste compound containing potassium compound.