发明名称 THIN-FILM DIODE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film diode, wherein either an alignment process can be dispensed with as much as possible or an alignment process is not required to be high in accuracy, capable of coping with an enlargement of the diode in area or micronization of the diode in size at a high level, without deteriorating the diode in characteristics and dealing with a roll-to-roll production method, where a plastic board is used. SOLUTION: A lower electrode 2 is formed on a lower board 10, and a nonlinear resistive film 4 is formed thereon. An insulating film which contains, for instance, conductive particles 18 is formed on the nonlinear resistive film 4, and an upper electrode 8 is formed thereon. In a figure, codes 12, 14, and 16 denote a liquid crystal, a counter electrode, and an upper board respectively. Only the micro-regions of the nonlinear resistive film 4 corresponding to the conductive particles 18 contained in the film 4 function as a resistive film, so that the regions where the nonlinear resistive film 4 function can be adjusted, by changing them in conductive particle density without micro-processing.</p>
申请公布号 JPH11214768(A) 申请公布日期 1999.08.06
申请号 JP19980012729 申请日期 1998.01.26
申请人 RICOH CO LTD 发明人 ISHII TOSHIHIRO
分类号 G02F1/136;G02F1/1365;H01L49/02;(IPC1-7):H01L49/02 主分类号 G02F1/136
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