| 摘要 |
PROBLEM TO BE SOLVED: To reduce an engagement and release resistance between terminal metal fittings and extend a period capable of proper soldering after tin plating. SOLUTION: In a mount part 12 to be soldered, a tin plating layer 15 is made thicker more than the thickness of a contact part 11 with a counterpart terminal bracket. By thickening the tin plating layer 15, time required for alloying with tin and zinc deposited from a base material 13 to reach a surface of the tin plating layer 15 is extended, thereby a period in which proper soldering is possible after tin plating processing is extended. On the other hand, at the contact part 11, there is no need for thickening the tin plating layer 15 to retard alloying, so that the overall thickness can be relatively thinned, and engagement and release resistance between terminal brackets can be reduced. |
