| 摘要 |
PROBLEM TO BE SOLVED: To realize a low-dielectric-constant material having a dielectric constant not larger than that of a conventional dielectric material and having thermal resistance capable of enduring during the mounting process by compounding a compound, which chemically modified adamantane, and an insulating resin via chemical bonding. SOLUTION: A solution of. e.g. 10 wt.% of, alicyclic polyolefin formed by dissolving alicyclic polyolefin into tetrahydrofuran is reacted with adamantane bromide (C10 H15 Br) and Grignard's reagent CH2 =CHMgBr to synthesize chemically modified adamantane with one introduced vinyl radical, and this chemically modified adamantane is dissolved until the saturated solution thereof is formed. After this saturated solution is spread on a copper substrate and dried, a heat treatment is carried out e.g. at 220 deg.C for 5 minutes, in a nitrogen atmosphere to thermally cure it. Then, the resin is cured by carrying out a heat treatment, e.g. at 200 deg.C for 5 hours, as after-cure to form a low-directric constant insulating film. |
