PRE-VACUUM CHAMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a pre-vacuum chamber for a semiconductor manufacturing apparatus wherein dewing and stirring of particles in a pre-vacuum chamber attached to a semiconductor substrate treating chamber are avoided when exhausting or introducing a gas and esp. particles do not stick to a semiconductor substrate surface, if the particles stir up. SOLUTION: The pre-vacuum chamber is attached to a semiconductor substrate treating chamber in a wiring manufacturing apparatus and comprises at least a substrate mount 5 for mounting a substrate carried in or out of the treating chamber and gas feed hole and gas exhaust hole 3a for substituting or reducing the pressure of an atmosphere in the chamber in which the substrate is mounted. On the floor of this camber 1 the gas exhaust hole 3a is disposed like a closed annular belt surrounding the substrate mount 5 and a gas- permeable porous body 3 is disposed in the exhaust hole 3a.