| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, in which the thickness of a molded part of a package is small with respect to the thickness of a semiconductor element to be sealed by molding, as compared with a conventional case. SOLUTION: A recessed part is arranged on the back side of a semiconductor element 10 and constituted of a rectangular trench 10e, having a rectangular bottom surface and four trenches 10a, 10b, 10c, 10d which stretch radially from four corners of the rectangular trench 10e to four corners of the semiconductor element. Mold sealing is performed in a state such that a die pad 12 of a lead frame 18 and in a state with four die pad supports 14a, 14b, 14c, 14d which stretch radially from four corners of the die pad 12 are inserted in the recessed part. |
