| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame with a radiating plate which is superior in adherence to a copper foil and a sealing material, and a semiconductor device using the lead frame which is satisfactory in electrical characteristics and solder resistance reflow. SOLUTION: In a lead frame with a radiating fin, an adhesive agent layer surface of a copper foil in which a heat resistant adhesive agent layer is laminated on the single side surface is stuck on a surface, opposite to a bonding surface of an inner lead. The adhesive agent is a heat-resistant resin composite containing at least one kind or more from among aromatic polyamide, aromatic polyimide, aromatic polyamideimide, aromatic polyetheramide, aromatic polyetherimide, aromatic polyetheramideimide, aromatic polyester and aromatic polyether. A copper foil surface opposite to the adhesive agent layer is treated with silane compound. |
