ELECTRONIC PART MOUNTING BODY, ELECTRONIC APPARATUS USING THE SAME AND METHOD FOR MANUFACTURING ELECTRONIC PART MOUNTING BODY

摘要

PROBLEM TO BE SOLVED: To prevent defective connection between a connection face of a conductive pattern of a substrate and an electrode of electronic parts. SOLUTION: This mounting body comprises a substrate 1 in which a conductive pattern 4 is provided on at least a face; and an IC 7 mounted on a face where the conductive pattern 4 of the substrate 1 is provided. The IC 7 has a bump electrode 7a on a side of the substrate 1, and a connection face 4a of the conductive pattern 4 counter to the bump electrode 7a is roughed, and the bump electrode 7a of the IC 7 is connected to this roughed connection face 4a with conductive adhesives 8.