| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize high density mounting by reducing the area at the wiring pattern part of a thin film wiring layer required for circuit correction and flattening the level difference at a contact hole, thereby increasing the number of connection pads. SOLUTION: A thin film wiring layer and terminal connection pads are formed on a ceramic multilayer wiring board 1 and an electronic device 14, e.g. an LSI, is mounted through a brazing material on the terminal connection pads 12 provided on the thin film layer 2. When a short circuit failure 9 occurs in the wiring layer of ceramic multilayer wiring board 1 in a circuit wiring group 16b, a terminal connection pad 12c is connected with a wiring layer 7c which is then connected through a repair conductor 15 with a repair line 8b at a desired connecting part thereof. The wiring pattern part at the contact hole forming part of an insulation layer 10 is prevented from being connected by etching, or the like. Consequently, a thick film connecting part 4c causing a short circuit failure 9 is not connected with the pad 12c. The pad 12c is connected with a repair line 8c and the circuit is repaired.</p> |
