| 摘要 |
PROBLEM TO BE SOLVED: To provide the high frequency shield case of a semiconductor laser device for reducing heat and time required for soldering work for fixing the high frequency shield case, facilitating the work and eliminating the reliability decline of a laser diode by the heat during the work. SOLUTION: This case is provided with a soldering fixation plate 52 fixed to a fixing member by a screw 54 together with a semiconductor laser holding member 50, a first high frequency shield case half 56 piled up on the opposite side of the holding member 50 on the fixation plate 52 and provided with an opening 56a for inserting the terminal 14a of a semiconductor laser 14, a second high frequency shield case half 60 piled up and arranged on the first high frequency shield case half 56 for storing a high frequency oscillation circuit board 58 connected to the terminal 14a in cooperation with the first high frequency shield case half and solders 62a and 62b for connecting the solder attaching part 52c of the fixation plate 52 and at least a part corresponding to the solder attaching part 52c in the second high frequency shield case half. |
