| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent resin adhesive for bonding and fixing a semiconductor element from unnecessarily spreading, and to hardly operate the electric connection of the electrode of the semiconductor element through a bonding wire with a prescribed metallize wiring layer. SOLUTION: A package for a semiconductor element is constituted of an insulating substrate 1 in which plural metallize wiring layers 7 are coated and derived from a mount part 1a, on which a semiconductor element 3 is mounted and the surrounding part of the mount part 1a through an outer surface and a cover body 2, and the semiconductor element 3 is bonded and fixed through resin adhesive 5 to the semiconductor element mount part 1a of the insulating substrate 1, and the cover body 2 is joined to the insulating substrate 1, and the semiconductor element 3 is air-tightly housed in a container constituted of the insulating substrate 1 and the cover body 2. In this case, at least the surface of the semiconductor element mount part 1a of the insulating substrate 1 is coated with a coating 6 made of fluoride surface active agent.</p> |
