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发明名称
SOLDER BUMP FORMING METHOD
摘要
申请公布号
JPH11214443(A)
申请公布日期
1999.08.06
申请号
JP19980011091
申请日期
1998.01.23
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
SAKAMI SEIJI
分类号
H01L23/12;H05K1/11;H05K3/34;(IPC1-7):H01L21/60
主分类号
H01L23/12
代理机构
代理人
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地址
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