发明名称 INSPECTION OF SECOND BONDING POINT IN WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To provide an inspecting method of second bonding point in wire bonding capable of shortening the inspection time and efficiently and surely judging the presence of a crescent. SOLUTION: The image of a bonding point is taken by a camera, and stored as an image data. A triangle 40 as a standard pattern approximating the form of a standard crescent 6c is preset, and the triangle 40 is rotated on the picture, based on the image data according to the wire extension angle α of the bonding point of an object to be inspected, and matched to the crescent 6a while searching by superposing it on the image of the bonding point, and when the maximum value of the matching ratio is larger than a threshold, the presence of the crescent 6c is judged. According to this, the time required for the inspection can be shortened, and the presence or absence of the crescent 6c can be efficiently and surely judged.
申请公布号 JPH11211430(A) 申请公布日期 1999.08.06
申请号 JP19980012483 申请日期 1998.01.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUZAKI HIROFUMI
分类号 G01B11/24;H01L21/60 主分类号 G01B11/24
代理机构 代理人
主权项
地址