| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a semiconductor device by miniaturizing a lead frame. SOLUTION: A lead frame 10 is provided with a brim type lead frame brim constituted of an outer brim and an inner brim, a tab which is positioned in the lead frame brim and fixes a semiconductor chip, a plurality of leads 3 whose inner ends extend to the periphery of the above tab, a dam 14 linking the leads 3, a tab suspending lead which supports the tab and connected with at least the dam 14, a linkage part 15 which supports the outer end of each lead of a lead group, constituted of a plurality of the leads 3 which are arranged in parallel and stretched, and stretches along the outer brim or the inner brim, and a transformation part 21 which links the linkage part 15 and the lead frame brim, does not protrude to the direction of the lead frame brim along the linkage part 15, and can be transformed, in accordance with the movement of the lead 3 supported by the linkage part 15 to the lead frame brim center. |
