| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein electrodes of a semiconductor element can be surely and tightly electrically connected to specified metallized wiring layers through electric connection means such as bonding wires and the semiconductor element is completely hermetically covered with a mold resin whereby the semiconductor element can be normally and stably operated for a long time. SOLUTION: The semiconductor device is composed of a mount 1a on the top face of which a semiconductor element 3 is mounted, insulation base 1 to which a plurality of wiring layers 2 for electrically connecting electrodes of the semiconductor element 3 mounted on the mount 1a are deposited, semiconductor element 3 adhered to the mount 1a of the insulation base 1 through a resin adhesive 4, and a mold resin 7 covering at least the semiconductor element 3. In this case a film 6 of a fluoric surfactant deposited to the surface of the insulation base 1.</p> |
