| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device capable of ensuring enhancements in joining strength of a bump joint and certain conductivity irrespective of a film thickness of a solder resist film. SOLUTION: A wiring electrode 11 is formed on a surface of a wiring substrate 10, and a bare chip 20 is mounted as a flip chip for the wiring electrode 11, and also surface mount parts 23, 24 are soldered and a portion excuding the soldered part is coated with a solder resist film 15. A space is provided in a portion of the solder resist film 15 corresponding to a bare chip mounting part 12, and the bare chip 20 is bump-joined to this space by solid-phase diffusion of a metal bump 22. |
