| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which high mounting density can be readily attained. SOLUTION: A semiconductor chip 20 in which integrated circuits 22, 23 are formed on both faces of a silicon substrate 21 and a semiconductor chip 30 in which integrated circuits 32, 33 are formed on both faces of a silicon substrate 31 are laminated. The integrated circuits 22, 23, 32, 33 are electrically connected to each other via a solder bump and a metal fine wire, and are connected to an external circuit via a solder ball formed in a printed wiring board 12. |
