| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor plastic package whose heat radiation and heat resistance after moisture absorption or the like are excellent. SOLUTION: This is a semiconductor plastic package of a ball grid array using a metal core print wiring board. One part of a metal core is exposed at one part of the front and back surfaces, and a semiconductor chip fixed on the exposed metal pat on the surface and the surrounding circuit conductor are connected by wire bonding. A front and back circuit insulated by a thermosetting resin composition with the metal core is conducted by a through-hole conductor insulated through the thermosetting resin composition with the metal core having a slit hole, and one or more through-holes are directly connected with the metallic core, and the semiconductor chip, wire, and bonding pad are resin sealed.</p> |
