SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a small-size and low-cost semiconductor device which has an electromagnetic shield function and is superior in thermal fatigue resistance of connections of built-in electronic components and air tightness. SOLUTION: A wiring (metal) board 10, components such as one or more semiconductor elements 21 and passive elements connected to the wiring board through an alloy 25, and insulative resin-made seal body 30 covering specified parts of the wiring board and components are provided. The alloy 25 is an alloy composed of Sn 90 wt.% or more and (dispersion) added one or more metals selected among Sb, Ag, Zn, In, Cu and Bi. The seal body 30 contains a metal magnetic powder (alloy powder contg. Fe powder or at least one metal selected among Fe, Si, Al, Ni, Mo, Mn, Cu, Cr and Co) or ferrite powder 35-95 wt.% added to an org. (epoxy) resin and the thermal expansion coefficient is 14-20 ppm/ deg.C.