| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a high-frequency element, the lid body of which dose not cause characteristic impedance mismatching, etc., and which has a superior hermetically sealing characteristic and transmission characteristic. SOLUTION: A dielectric substrate 7 is buried in the surface of the metallic substrate 1 of a heat sink, etc., having a high-frequency element 2 mounting section, with the surface of the substrate 1 crossing the bonding spots of a lid body which is bonded to the surface so as to form a cavity for airtightly sealing the element 2, and a first high-frequency transmission line, such as the microstrip line 10, etc., connected to the element 2 is formed on the surface of the substrate 7 in the cavity. Then a second high-frequency transmission line, such as the dielectric waveguide, etc., is formed in the outside area of the cavity and electromagnetically coupled with the first transmission line. In addition, a third high-frequency transmission line, such as the microstrip line 14, etc., is formed on the surface of the dielectric substrate 1 on the outside of the cavity and electromagnetically coupled with the second transmission line. |
