发明名称 |
Verfahren zur Montage integrierter Schaltkreise mit Schutz der Schaltkreise vor elektrostatischer Entladung und entsprechende Anordnung von integrierten Schaltkreisen mit Schutz vor elektrostatischer Entladung |
摘要 |
A method and a circuit arrangement for protecting integrated circuits against electrostatic discharge (ESD) during and after packaging. An electrical connection between two integrated circuits is made by producing a low-impedance connection in the first integrated circuit, between a signal pad and a pad for a supply potential. The connection has a portion of reduced cross section, which is preferably severed by a current pulse applied after the arrangement has been assembled in a package and the connection has been electrically bonded to the second integrated circuit. The ESD protection during assembly requires no additional chip surface area. |
申请公布号 |
DE19743344(C2) |
申请公布日期 |
1999.08.05 |
申请号 |
DE1997143344 |
申请日期 |
1997.09.30 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
MAYER, ALBRECHT, DR.-ING., 81377 MUENCHEN, DE |
分类号 |
H01L23/60 |
主分类号 |
H01L23/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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