发明名称 |
SEMICONDUCTOR LASER DEVICE |
摘要 |
A semiconductor laser device which comprises a semiconductor laser array (1), plate-like submounts (2) which has a thermal expansion coefficient approximately the same as that of the semiconductor laser array and has a high thermal conductivity and heatsinks (3) which have cooling water passages (4) which enable cooling water to be in direct contact with the submounts so as to cool the submounts. The cooling efficiency of the semiconductor laser device is improved. A semiconductor laser device comprises semiconductor laser modules each having a semiconductor laser array (1), submounts (2) and heatsinks (3). The semiconductor laser modules which are arranged in parallel with each other, and cooling water is supplied in parallel to the respective modules to cool the modules uniformly.
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申请公布号 |
WO9939412(A1) |
申请公布日期 |
1999.08.05 |
申请号 |
WO1998JP00402 |
申请日期 |
1998.01.30 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA;SATO, SHINJI;USUI, AKARU;FUKUMURA, KYOUKO |
发明人 |
SATO, SHINJI;USUI, AKARU;FUKUMURA, KYOUKO |
分类号 |
H01S5/024;H01S5/40;(IPC1-7):H01S3/18;H01S3/043 |
主分类号 |
H01S5/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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