发明名称 METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
摘要 A semiconductor component comprises a substrate (101), a two flexible pressure sensor diaphragms (106, 303) supported by the substrate (101), and a fixed electrode (203) between the two diaphragms (106, 303). The two diaphragms (106, 303) and the fixed electrode (203) are electrodes of two differential capacitors. The substrate (101) has a hole (601) extending from one surface (107) of the substrate (101) to an opposite surface (108) of the substrate (101). The hole (601) is located underneath the two diaphragms (106, 303), and the hole (601) at the opposite surfaces (107, 108) of the substrate (101) is preferably larger than the hole (601) at an interior portion of the substrate (101).
申请公布号 WO9939170(A1) 申请公布日期 1999.08.05
申请号 WO1999US01813 申请日期 1999.01.28
申请人 MOTOROLA INC. 发明人 GOGOI, BISHNU, P.;MONK, DAVID, J.
分类号 G01L9/12;G01L9/00;H01L29/84;(IPC1-7):G01L9/00 主分类号 G01L9/12
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