| 摘要 |
<p>The present invention is directed towards an embedded electrical storage device in a layered electrical device, such as a printed board or IC chip. The layered electrical device comprises an outer surface. An electrical energy storage device is embedded in the layered electrical device, either partially or fully. The electrical energy storage device comprises at least two electrical conducting layers sandwiching a high capacity dielectric, and is connected to other circuitry on the layered electrical device.</p> |
