发明名称 PROCESS FOR METAL PLATING LIQUID CRYSTALLINE POLYMERS AND COMPOSITIONS RELATED THERETO
摘要 Liquid crystalline polymers (LCP) may be sputter-coated or ion-plated with palladium to yield palladium coated LCP parts. These may be electrolytically plated, as with copper, using normal or unusually high current densities, to make metal plated LCP in which the metal has good adhesion to the LCPs. Before or after the electrolytic plating, the metal coating may be patterned. Parts containing patterned metal surface may be used as circuit boards or printed wire boards.
申请公布号 CA2316868(A1) 申请公布日期 1999.08.05
申请号 CA19992316868 申请日期 1999.01.27
申请人 E.I. DU PONT DE NEMOURS AND COMPANY 发明人 BEITINGER, GUNTER;KOLBECK, GERALD
分类号 C25D5/56;C23C14/02;C23C14/20;C23C28/02;H05K3/02;H05K3/38;(IPC1-7):C23C14/20;C25D7/00 主分类号 C25D5/56
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