| 摘要 |
<p>A component placement apparatus (1) comprises a component placement station (2) having a support table (3) for positioning a sheet of printed circuit boards (4). Three carrier plates (7a,b,c) are cycled around the component placement apparatus (1). Plate (7a) moves past a head mount (8) on which pick and place heads (9) are mounted. The head mount (8) is moved up and down in a vertical plane and plate (7a) moves below the pick and place heads (9) in a horizontal plane. Tapes (10) carrying microchips or other components (11) are moved over rollers (12) in a horizontal plane in the same direction as the plate (7a). Plates (7a,b,c) have holes (13) through the plate and indentations (14) for receiving the components (11). The pick and place heads (9) move up and down through the holes (13) as the plate (7a) passes the head mount (8) and the heads (9) pick up a component (11) from the tape (10) and raise it above the plate (7a). As the plate (7a) continues to move, the heads (9) descend again and deposit the components (11) in the indentations (14), where they are held in position by a vacuum effect through holes in the plate (7a). The plate (7a) is then moved to allow the components (11) to be positioned on the sheet of printed circuit boards (4).</p> |
