Leiterplatte und Randverbinder dafür, und Verfahren zur Vorbereitung eines Leiterplattenrandes

摘要

The circuit board includes an edge with an edge surface, two opposite major surfaces extending from the edge surface at least one on which a circuitry is defined. A number of plated through holes is also included having a selected radius and spaced inwardly from the edge surface The through holes are perpendicular to the major surfaces and in electrical contact with the circuitry of the circuit board. A number of board openings is formed on the edge of the circuit board extending from one of the two major surfaces at least toward the other major surface. Each the board openings intersect a respective one of the through holes.