Substrate for forming high-strenght thin semiconductor element and method for manufacturing high-strength thin semiconductor element

摘要

A substrate for forming a high-strength thin semiconductor element includes a thick portion and a thin portion in the front surface or in both front and rear surfaces of the substrate, the thick portion maintaining a thickness of the substrate as initially used or having a thickness that gives a sufficient strength to the substrate, the thin portion being formed by selectively removing a portion of the substrate other than the thick portion and having a thickness smaller than the thick portion and larger than or equal to 20 mu m.