发明名称 EPOXY RESIN COMPOSITION, ITS PRODUCTION AND PRODUCTION OF PREPREG
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having high properties such as appearance after etching and heat resistance without generating measling and useful for a laminated board, etc., by compounding a master batch obtained by blending respectively specific dicyandiamide with a resin into an epoxy resin. SOLUTION: This epoxy resin composition is obtained by preparing a master batch so as a content of dicyandiamide to be 10-60 wt.% by blending the dicyandiamide having <=30μm maximum particle diameter and <=10μm average particle diameter as a hardener with a resin such as phenol novolak having <=100 poise viscosity below a temperature not eluting the dicyandiamide and compounding the master batch into an epoxy resin. Preferably, crushed dicyandiamide is further dispersed into the master batch or a coagulation inhibitor is compounded into the master batch, and preferably a prepreg is produced by coating the composition on a base material, heating and impregnating the base material with the composition.
申请公布号 JPH11209580(A) 申请公布日期 1999.08.03
申请号 JP19980014557 申请日期 1998.01.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FUKUHARA YASUO;MATSUMURA MASAHIRO;NAKAMURA YOSHIHIKO;HATSUTA YUKIHIRO
分类号 C08J5/24;C08G59/50;C08K3/00;C08L63/00;(IPC1-7):C08L63/00 主分类号 C08J5/24
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