发明名称 |
Standoff controlled interconnection |
摘要 |
A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion. |
申请公布号 |
US5931371(A) |
申请公布日期 |
1999.08.03 |
申请号 |
US19970784333 |
申请日期 |
1997.01.16 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
PAO, YI-HSIN;JIH, CHAN-JIUN;HU, JUN MING;JAIRAZBHOY, VIVEK AMIR;MCMILLAN, II, RICHARD KEITH;SONG, XU |
分类号 |
B23K35/02;H01L21/60;H05K3/30;H05K3/34;(IPC1-7):B23K31/02;B23K35/24;B23K35/14 |
主分类号 |
B23K35/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|