发明名称 |
Electronic component lid that provides improved thermal dissipation |
摘要 |
A lid that provides thermal dissipation for an integrated circuit. The lid is designed to be fastened to a printed circuit board and includes a casing having thermally conductive upper and lower plates. Between the upper and lower plates, inside the casing, is a hollow interior region within which vaporizing fluid and two or more segments of wick reside.
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申请公布号 |
US5933323(A) |
申请公布日期 |
1999.08.03 |
申请号 |
US19970964908 |
申请日期 |
1997.11.05 |
申请人 |
INTEL CORPORATION |
发明人 |
BHATIA, RAKESH;REGIS, KAREN M. |
分类号 |
H01L23/04;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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