| 发明名称 |
Heat resistant resin composition and adhesive sheet using the same |
| 摘要 |
A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300 DEG C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.
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| 申请公布号 |
US5932351(A) |
申请公布日期 |
1999.08.03 |
| 申请号 |
US19970940009 |
申请日期 |
1997.09.29 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
SHINADA, EIICHI;TSURU, YOSHIYUKI;HORIUCHI, TAKESHI |
| 分类号 |
C08L63/00;C08L79/08;H05K1/00;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):B32B27/38;C08F283/04 |
主分类号 |
C08L63/00 |
| 代理机构 |
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