| 摘要 |
A chemical mechanical polishing apparatus is provided which is capable of polishing an essentially non-streaked mirrored surface in a highly efficient manner, and which is capable of achieving a degree of flatness of +/-0.1 mm or less. The apparatus is provided with a polishing plate holder 43 which adheres to a material to be polished 40 and rotates; a plurality of polishing pads 42 which have a diameter smaller than that of the material to be polished 40 and which are disposed in a symmetrical manner about an axle, a mechanism for causing the plurality of polishing pads 42 to rotate individually, a mechanism for causing the plurality of polishing pads 42 to revolve about the axle and a mechanism for causing the polishing pads 42 to move in a transverse and longitudinal manner with respect to the material to be polished 40; the front surfaces of the polishing pads 42 are caused to rub against the surface of the material to be polished, and a polishing slurry is supplied to the center of the front surfaces of the polishing pads 42. The polishing slurry is supplied in a pressurized manner, and uniformity and flatness are thus improved. The polishing slurry is degassed, and by means of this variations in flatness are reduced. A dummy plate which surrounds the periphery of the material to be polished is provided so as to be in the same plane with the surface to be polished. |
