发明名称 DEVICE FOR HOLDING SUBSTRATE TO BE GROUND AND METHOD FOR GRINDING THE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To make the grinding rate of the center part of a substrate equal to that in a peripheral edge part by pressing the substrate to a grinding pad with equal pressing forces applied to the center part of the substrate and the peripheral edge part. SOLUTION: A substrate holding device 15A for holding a substrate 12 is arranged above a grinding pad 11. The substrate holding device 15A is provided with a rotary shaft 16A, a substrate holding head 17A provided integrally with the rotary shaft 16A, and a guiding member 19A fixed to the substrate holding head 17A. The substrate holding head 17A includes a sealing member 20 provided to be moved up and down, a first space part 21 is formed by the substrate holding head 17A, the sealing member 20 and the substrate 12, and a second space part 22 is formed by the substrate holding head 17A and the sealing member 20. A first fluid supply route 25 is communicated with the first space part 21, and a second fluid supply route 26 is communicated with the second space part 22.
申请公布号 JPH11207602(A) 申请公布日期 1999.08.03
申请号 JP19980016499 申请日期 1998.01.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIO MIKIO
分类号 B24B37/005;B24B37/30;H01L21/304 主分类号 B24B37/005
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