发明名称 |
Material for producing electrically conducting connections in thermoplastic moldings |
摘要 |
The invention relates to a material for producing electrically conducting connections in thermoplastic moldings, wherein the material contains a thermoplastic containing 0.5 to 30% by volume of conductive fibers having a length of 5 to 20 mm and a diameter of 5 to 100 mu m and has a volume resistivity of less than 1 ohm.cm.
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申请公布号 |
US5932324(A) |
申请公布日期 |
1999.08.03 |
申请号 |
US19950511260 |
申请日期 |
1995.08.04 |
申请人 |
HOECHST AKTIENGESELLSCHAFT |
发明人 |
PFEIFFER, BERNHARD |
分类号 |
H01R11/01;C08K7/02;H01B1/00;H01B1/20;H01B1/22;H01B1/24;H05K1/09;H05K3/32;(IPC1-7):B32B3/00;B32B7/00;B32B15/00 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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