发明名称 Material for producing electrically conducting connections in thermoplastic moldings
摘要 The invention relates to a material for producing electrically conducting connections in thermoplastic moldings, wherein the material contains a thermoplastic containing 0.5 to 30% by volume of conductive fibers having a length of 5 to 20 mm and a diameter of 5 to 100 mu m and has a volume resistivity of less than 1 ohm.cm.
申请公布号 US5932324(A) 申请公布日期 1999.08.03
申请号 US19950511260 申请日期 1995.08.04
申请人 HOECHST AKTIENGESELLSCHAFT 发明人 PFEIFFER, BERNHARD
分类号 H01R11/01;C08K7/02;H01B1/00;H01B1/20;H01B1/22;H01B1/24;H05K1/09;H05K3/32;(IPC1-7):B32B3/00;B32B7/00;B32B15/00 主分类号 H01R11/01
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