发明名称 GRINDING METHOD AND INP SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To increase the degree of flatness and to form a phase thicker in an outer peripheral part than in a center part by controlling the kinds, flow rates and supply positions of grinding fluid and chemical solution. SOLUTION: By using a grinding device for performing grinding by pressing a work 2 to a surface plate 1 rotated while supplying chemical solution from at least two or more nozzles on the surface plate, grinding fluid A is supplied from at least one nozzle, for example, to the center part of the surface plate 1, grinding fluid having a grinding are different from that of the grinding fluid A, alternatively chemical solution having no grinding rates, otherwise chemical solution B for changing the grinding rate of the grinding fluid A is supplied from the other nozzle for example to a part outside a position 3 where the center of the work 2 is an outermost side on the surface plate 1 and inside a position 4 in contact with the outermost periphery of the work 2, and by intentionally generating an area having a different grinding rate, grinding is performed to control the shape of the work.
申请公布号 JPH11207607(A) 申请公布日期 1999.08.03
申请号 JP19980024071 申请日期 1998.01.22
申请人 JAPAN ENERGY CORP 发明人 SUZUKI KENJI
分类号 B24B37/00;H01L21/304 主分类号 B24B37/00
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