| 摘要 |
PROBLEM TO BE SOLVED: To improve a size stability by dissipating heating in a high density circuit by a method wherein a metallic foil is stuck through an adhesive layer on one or both sides of a polybenzoazole film. SOLUTION: In the metallic foil clad film, a polybenzoazole is used as a film raw material. The polybenzoazole is a polymer of a benzooxyazole or a benzoazole, and an alkyl or a halogen derivative thereof. It is preferable that a thickness of a polybenzoazole film is 3 to 300μm, the thickness of an adhesive layer is 0.5 to 50μm, and the thickness of the metallic foil is 3 to 100μm. It is preferable from the point of an electric conductivity to use a copper foil and the metallic foil for the use of a flexible printed substrate. Further, a polyparaphenylene-benzobisoxazole in the polybenzoazole is preferable since respective characteristics of a heat resistance or the like are excellent.
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