| 摘要 |
A method of forming a multilayer interconnection structure includes the steps of forming a contact hole in an interlayer insulation film, depositing the contact hole by a conductive plug of a refractory element, applying a sputter-etching process to the interlayer insulation film to form a tapered part at a top part of the contact hole while using the conductive plug as an etching stopper, and filling the tapered part of the contact hole by a conductor material by a sputtering process.
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