| 摘要 |
A ceramic wiring board having a metalized part. The metalized part contains 100 parts by weight of an electrical-conduction imparting material made of at least one metal selected from the group consisting of Ag, Pd, Au and Pt; 3 to 5 parts by weight of a W and/or Mo compound, calculated in terms of metal W and/or metal Mo; and 1 to 10 parts by weight of a glass composition. The W compound includes WO3 and/or WSi2, while the Mo compound includes MoSi2. In the ceramic wiring board, the shrinkage behavior on sintering of the wiring material can be made similar to that of the ceramic material, so that warping and deformation of the wiring board are minimized.
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