| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing device especially improving an adhesiveness of a pre-plating frame such as Pd or Pd-Au with a resin composition, improving resistance to reflow soldering of a semiconductor sealing device, preventing deterioration by moisture absorption after the reflow and having high reliabilities. SOLUTION: This invention relates to a sealing resin composition containing (A) an epoxy resin, (B) a novolak-type phenolic resin, (C) dibutylthiourea and (D) an inorganic filler as essential components and containing 0.001-0.5 wt.% of the component C and 25-95 wt.% of the component D to the resin compositions, and a semiconductor sealing device in which semiconductor chips are sealed with the sealing resin composition. |
