发明名称 |
Open-bottomed via liner structure and method for fabricating same |
摘要 |
This invention relates to a method of forming a bottomless liner structure. The method involves the steps of first obtaining a material having a via. Next, a first layer is deposited on the material, the first layer covering the sidewalls and bottom of the via. Finally, a second layer is sputter deposited on the first material, the material Rf biased during at least a portion of the time that the second layer is sputter deposited, such that the first layer deposited on the bottom of the via is substantially removed and substantially all of the first layer deposited on the sidewalls of the via is unaffected.
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申请公布号 |
US5933753(A) |
申请公布日期 |
1999.08.03 |
申请号 |
US19960767572 |
申请日期 |
1996.12.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SIMON, ANDREW H.;UZOH, CYPRIAN E. |
分类号 |
H01L21/285;H01L21/768;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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