发明名称 |
LEAD FRAME OF SEMICONDUCTOR PACKAGE |
摘要 |
A lead frame structure of a semiconductor package including a plurality of leads, a respective dam bar extended from at least one of the plurality leads toward an adjacent lead and having a certain distance provided between the respective dam bar and the adjacent lead, and an insulating adhesive member is filled between the leads and the dam bars. The lead frame structure prevents leads from bending or twisting. |
申请公布号 |
KR100214480(B1) |
申请公布日期 |
1999.08.02 |
申请号 |
KR19960016643 |
申请日期 |
1996.05.17 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO.,LTD. |
发明人 |
KANG, TAC-KYU;KIM, DONG-YOU |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|