SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND PACKAGE FOR SEMICONDUCTOR DEVICE
摘要
The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.
申请公布号
KR100213857(B1)
申请公布日期
1999.08.02
申请号
KR19960071161
申请日期
1996.12.24
申请人
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION;MITSUBISHI, DENKI KABUSHIKI KAISHA