首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
MASTER ELECTRODE PAD OF SEMICONDUCTOR CHIP AND TAP PACKAGE USING IT
摘要
申请公布号
KR100213435(B1)
申请公布日期
1999.08.02
申请号
KR19960029800
申请日期
1996.07.23
申请人
SAMSUNG ELECTRONICS CO, LTD.
发明人
YOON, JIN-HYUN
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
DEVICE FOR FILLING DISCHARGED SOIL OF BRICK MOLDING MACHINE
SIMPLE UNATTENDED MACHINING CENTER
SHEARING MACHINE FOR MOVING WORK
OUTLINE CUTTING-OFF DEVICE FOR PRINTED CIRCUIT BOARD ROOTER
METHOD AND EQUIPMENT FOR TURNING WORK
COMBINATION ELECTRIC CONTACT
SUPPORTER FOR MATERIAL
(B2) ;FLOW-THROUGH MICROREACTOR
(B2) ;METHOD OF FLOTATING USEFUL MINERALS IN PARTICULAR THOSE CONTAINING INCREASED PROPORTION OF LOAMY COMPONENTS
(B2) ;METHOD OF OBTAINING NITROGEN MONOXIDE OF LOW NITROGEN CONTENT
(B2) ;APPARATUS FOR REMOTE MEASUREMENT OF LEVEL OF LIQUID IN TANKS,ESPECIALLY IN SHIP TANKS
(B1) ;THICK-LAYER HV RESISTOR
(B1) ;METHOD OF OBTAINING 1-AMINO-4-/4''-AMINOPHENYLO/-AMINOANTRAQUINONO-2,3''-BISULFONIC ACID
(B1) ;CONTROL SYSTEM OF ELECTROMECHANICAL DIFFERENTIAL COUNTER
(B1) ;APPARATUS FOR THRESHING PAPILIONACEOUS SMALL-SEED PLANTS IN PARTICULAR CLOVER
(B1) ;METHOD OF MANUFACTURE OF SUSPENSION POLYTETRAFLUOROETHYLENE
(B1) ;ROOF SUPPORT PROP
(B1) ;APPARATUS FOR ARC SURFACE WELDING
(B1) ;MICROWAVE ATTENUATOR OF HIGH PULSE POWERS,ESPECIALLY FOR TRANSMISSION-RECEPTION SWITCHES
(B1) ;CHUCKING HEAD WSLOCKING MECHANISM
