发明名称 |
METHOD FOR MANUFACTURE OF SEMICONDUCTOR PACKAGE |
摘要 |
A method for fabricating a semiconductor package having a semiconductor chip and leads attached to the chip includes the steps of placing a tape over the leads attached to the semiconductor chip, forming a mold to encapsulate the semiconductor chip and the leads while exposing a portion of the leads contacting the tape, and removing the tape over the leads after the mold forming step. |
申请公布号 |
KR100214555(B1) |
申请公布日期 |
1999.08.02 |
申请号 |
KR19970004406 |
申请日期 |
1997.02.14 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO.,LTD. |
发明人 |
HEO, KI-ROK |
分类号 |
B29C45/14;B29L31/34;H01L21/56;H01L23/12;H01L23/28;H01L23/31;H01L23/48;H01L23/495;H01L23/50 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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