HEAT-RESISTANT INSULATING FILM, RAW SUBSTRATE FOR PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCING THE SUBSTRATE

摘要

A raw substrate for a printed wiring board, characterized in that it comprises a film insulator comprising 65 to 35 wt.% of a polyarylketone resin and 35 to 65 wt.% of an amorphous polyetherimide resin and having a glass transition temperature of 150 to 230 DEG C and a peak temperature for crystal melting of 260 DEG C or higher, as measured by differential scanning colorimetry, and an electrically conductive foil adhered by fusion, optionally after providing a through hole and filling the hole with an electrically conductive paste, on at least one side of the film, and, after the adhesion by fusion of the foil, has a heat of fusion of crystal DELTA Hm and crystallization heat (which is generated by crystallization during the rise of temperature) DELTA Hc, as measured by differential scanning colorimetry in the course of temperature rise, which satisfy the following formula: [( DELTA Hm- DELTA Hc)/ DELTA Hm]